Bonding the wafers to each other and further reacting the surface to create a covalent bond
Equipment – Grinding Machine
Processing the relative motion of the machined surface for higher flatness
Equipment – Polishing Machine
Combining the principles of chemical and mechanical polishing to achieve a uniform polishing process when achieving a high degree of composite material
Consumables
Provide a wide range of products for all aspects of the process
OUR Product
extensive experienc
We have extensive experience in development and excellent system construction and believe that we can give our customers the best service experience.
