Based on current situation
| Item | Equipment Name | Model | Qty | Manufacturer |
|---|---|---|---|---|
| 1 | UV Ozone Cleaner | UV-300H | 1 | SAMCO |
| 2 | OVEN | VO 60L | 1 | CHANNEL |
| 3 | OVEN | QHMOL-1S | 1 | C SUN |
| 4 | OVEN | SMO-1S | 5 | C SUN |
| 8 | Profilometer / Surface Profiling System | Uni-map | 2 | EtaMAX |
| 9 | Single-Side Polishing Machine | 50GPAW-TD | 1 | Speedfam |
| 10 | Electronic Nitrogen Drying Cabinet | 15-50%RH 1250L | 2 | - |
| 11 | Automatic Mask Aligner | ELS106FA | 1 | ELS |
| 12 | Dicing Saw | DAD321 | 1 | Disco |
| 14 | Constant Temperature & Humidity Chamber | THS-A6T-150 | 1 | Kson |
| 15 | Metallurgical Microscope | MX61 | 1 | Olympus |
| 16 | Metallurgical Microscope | MX50 | 1 | Olympus |
| 17 | Metallurgical Microscope | Nikon L300 | 1 | Nikon |
| 18 | Metallurgical Microscope | L200 | 1 | Nikon |
| 19 | Toolmakers' Microscope | STM5 | 1 | Olympus |
| 20 | 32B Single-Side Lapping Machine | 32B-SPAW | 1 | Speedfam |
| 21 | 36B Polishing Machine | 36B-DAW | 1 | Speedfam |
| 22 | 36B Polishing Machine | 36B-DPAW | 1 | Speedfam |
| 23 | 36B Polishing Machine | 36B-GPAW | 1 | Speedfam |
| 24 | Non-contact Wafer Thickness Gauge | MX 203-6-41-q | 1 | E+H |
| 25 | Wafer Edge Grinding Machine | W-GM-4200 | 1 | Accretech (Tosei) |
| 26 | Wafer Edge Grinding Machine | W-GM-4200 | 1 | Accretech (Tosei) |
| 27 | Flatness Tester | FT-17 | 1 | NIDEK |
| 28 | Horizontal Spin Dryer | SH-801 w/ SCD-03 | 1 | ASSI |
| 29 | Single-Tank Ultrasonic Cleaner | NA | 1 | SKE |
