Auto Single Side Polishing System for processing larger-size sapphire wafer, providing automatic polishing equipment with load on load function with auto stage transfer, easy use with process controlled by PLC, high quality, fast speed, low cost
*Automatic arm load on load for automatic continuous production process
*Integrated with thickness measurement System
*Oscillation Spindle function for better production quality
*Automatic Grooving System
*Polishing angle control system, slotted angle groove
*Automatic cleaning function before loading finished wafer
*Applicable protection mechanisms to avoid losses caused by negligence
