Single side polishing equipment, design for multi and large size wafer process, with spindle independent control and process increasing processing efficiency and quality significantly
*Four Spindle with independent parameters settings *High precision finished thickness <± 2μ production
*Compatible with varies metal plate and Pad
*Automatically grooving system (Re-grooving function integrated) *Design with independent motor shaft improve process stability
*Plate temperature monitoring system, improve production quality
*Automated program control, functions extending possible
