New creation

OUR Product

Fully Automatic Wafer Bonder

Automatic blue tape lamination equipment, improve productivity, production quality, reduce operation costs

*Patented anti-fragment system design
*Warp age wafer possible to be laminated without wafer breakage
*Blue Tape spindle controlled by digital torque limiter for auto detect and adjust the torque blue tape's radius, so that blue tape tension can be controlled
*Floating roller design to ensure that the wafer average force Multiple PLC Programmed Protections
*Process parameters capable for custom design
 

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