Double-Side Lapping/Polishing Machine, applying abrasive powder or slurries for thinning or polishing process. Machine Size: 24", 28", 32", 36" currently
*PLC interface, ease to operate *Suit for all kind of wafers size, good thickness uniformity *Gantry design for better structural rigidity *Multi-stage compression settings *Multi-directional operation, the center gear can be positive or reversed for all kinds of product processing *Auto Thickness Measurement Function Possible
