OUR Product
CMP Slurry
Use of nanoscale abrasive particles and a special substrate preparation, a unique complex that tiny particles, low abrasive content of suspended excellent, high purity, fine grain size, no special cleaning process
*Base on Process requirement, abrasives will be used differently (Colloidal Silica,
*Polycrystalline alumina, or Cerium Oxide), and with each particular structure can effectively control the polishing temperature
*High removal rate, surface roughness excellent, achieve excellent finished surface
*Easy to clean, non-crystalline residue
